03.

Experience

Taiwan Mobile

Taiwan Mobile| Senior Software Engineer

2022.06 – Present

Responsible for requirements analysis, architecture design, development, testing, and maintenance of web systems.

  • Direct Carrier Billing PlatformAn integrated platform for OTT subscriptions, parking-fee collection, and prayer-lamp donations, connecting multiple billing systems and exposing APIs to external vendors.
  • Upgraded Spring Boot 2.x (JDK 8) to 3.x (JDK 17) to fix vulnerabilities, with AI-written unit and E2E automation tests.Read the case study
  • Built OpenSearch API latency dashboards to track API and DB call durations across nodes, accelerating incident diagnosis.Read the case study
  • Introduced Spec-Driven Development (SDD) and automated front-end/back-end testing (Playwright, Selenium, JUnit).
  • Refactored project APIs using Design Patterns, speeding up onboarding of new integrations and reducing logic errors.
  • Built a scheduled monitoring system that automatically sends email/SMS alerts when DB or log conditions are met.Read the case study
  • AI Meeting NoteA multilingual speech-to-text transcription platform.
  • Developed notification center push APIs, designing a cross-device push and read-status mechanism for Web and App clients.
#Java#Spring Boot#PostgreSQL#OpenSearch#Docker#Kubernetes#Argo CD#Playwright#Selenium#JUnit#SDD#Design Patterns
TSMC

TSMC| Process Integration Engineer

2019.10 – 2021.10

12-inch 3nm & 5nm process integration experience.

  • Developed a photolithography non-correctable-error ink-out detection system, cutting potential reliability-failure risk by ~1/3 (<0.2% yield loss); the system was later adopted by other fabs.
  • Automated daily data retrieval and charting with SAS EG (systematized SPC chart & auto report), reducing manual effort by ~95% and improving chart quality through standardization.
#Python#SAS EG#Photolithography Ink-out System#SPC#WAT#Yield Optimization#3nm/5nm R&D
VIS

VIS| Process Integration Engineer

2016.12 – 2019.06

8-inch 0.4um BCD process integration experience for commercial and automotive products.

  • Built the New Tape-Out (NTO) process flow and inline/WAT measurement programs.
  • Resolved WAT and yield excursion issues, ensuring wafer shipment quality and reliability targets were met.
#0.4um BCD Process#Automotive & Commercial#NTO#Inline Measurement#WAT#Yield Excursion